[Developed Product] Microparticles 'MSP-N Series'
It does not dissolve in many organic solvents! It has excellent heat resistance compared to general organic polymers.
The "MSP-N Series" consists of polymethyl silsesquioxane microparticles with a three-dimensional structure formed by siloxane bonds. Compared to general organic polymers, it exhibits excellent heat resistance and does not dissolve in many organic solvents. Additionally, we also offer composite particles called the "Silcrusta Series," which are coated with polymethyl silsesquioxane that has a three-dimensional structure formed by siloxane bonds. 【Features of the MSP-N Series】 ■ Excellent heat resistance compared to general organic polymers ■ Does not dissolve in many organic solvents *For more details, please refer to the PDF document or feel free to contact us.
- 企業:栄和
- 価格:Other